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RX210

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Product Overview

The first product in the RX200 Series

RX210 Flash MCUs bring new levels of capability and performance to ultra-low-power, low-voltage embedded-system applications. Based on the fast 32-bit RX CPU core, RX210 chips are the first members of the RX200 series of middle-range products.

 

 

Memory vs. Package Lineup

A package lineup ranging from 36 to 144 pins is planned, and we plan to support small packages such as QFN and LGA sequentially.

RX210 Group Memory vs. Package Lineup (LQFP, LGA)

Specifications

RX210 Group
32-bit RX CPU Core • Max. operating frequency: 50 MHz Capable of 78 DMIPS in operation at 50 MHz
• Accumulator handles 64-bit results (for a single instruction) from 32- x 32-bit operations
• Multiplication and division unit handles 32- x 32-bit operations (multiplication instructions take one CPU clock cycle)
• Fast interrupt
• CISC Harvard architecture with 5-stage pipeline
• Variable-length instructions, ultra-compact code
• On-chip debugging circuit
Low-power Design and Architecture • Operation from a single 1.62- to 5.5-V supply
• 1.62-V operation available (at up to 20 MHz)
• Deep software standby mode with RTC remaining usable
• Four low-power modes
On-chip Flash Memory for Code, No Wait States • 50-MHz operation, 20-ns read cycle
• No wait states for reading at full CPU speed
• 128- to 512-Kbyte capacities
• User code programmable via the SCI
• Programmable at 1.62 V
For instructions and operands
On-chip Data Flash Memory • Eight Kbytes
• Erasing and programming impose no load on the CPU.
On-chip SRAM, No Wait States 20- to 64-Kbyte size capacities
DMA • DMACA: Incorporates four channels
• DTC: Four transfer modes
ELC • Module operation can be initiated by event signals without going through interrupts.
• Modules can operate while the CPU is sleeping.
Reset and Supply Management • Nine types of reset, including the power-on reset (POR)
• Low voltage detection (LVD) with voltage settings
Clock Functions • Frequency of external clock: Up to 20 MHz
• Frequency of the oscillator for sub-clock generation: 32.768 kHz
• PLL circuit input: 4 to 12.5 MHz
• On-chip low- and high-speed oscillators, dedicated onchip low-speed oscillator for the IWDT
• Generation of a dedicated 32.768-kHz clock for the RTC
• Clock frequency accuracy measurement circuit (CAC)
Real-time Clock • Adjustment functions (30 seconds, leap year, and error)
• Time capture function
• Time capture on event-signal input through external pins
• RTC capable of initiating return from deep software standby mode
Independent Watchdog Timer 125-kHz on-chip low-speed oscillator produces a dedicated clock signal to drive IWDT operation.
Useful Functions for IEC60730 Compliance Self-diagnostic and disconnection-detection functions for the AD converter, clock-frequency accuracymeasurement circuit, independent watchdog timer, functions to assist in RAM testing, etc.
Up to Nine Communications Interfaces • Adjustment functions (30 seconds, leap year, and error)
• SCI with many useful functions (up to seven interfaces)
• Asynchronous mode, clock synchronous mode, smart card interface
• I2C bus interface: Transfer at up to 1 Mbps, capable of SMBus operation (1 interface)
• RSPI (1)
External Address Space • Four CS areas (4 x 16 Mbytes)
• 8- or 16-bit bus space is selectable per area
Up to 14 Extended-function Timers • 16-bit MTU2: input capture, output capture, complementary PWM output, phase counting mode (6 channels)
• 8-bit TMR (4 channels)
• 16-bit compare-match timers (4 channels)
12-bit A/D Converter • Capable of conversion within 1 µs
• Sample-and-hold circuits (for three channels)
• Three-channel synchronized sampling available
• Self-diagnostic function and analog input disconnection detection assistance function
10-bit D/A Converter
Analog Comparator
Programmable I/O Ports 5-V tolerant, open drain, input pull-up, switching of driving ability
MPC Multiple locations are selectable for I/O pins of peripheral functions
Temperature Sensor
Operating Temp. Range -40 °C to +85°C

Product Lineup:


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