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Product Overview:

Products in the H8S/2218 and 2212 Group are equipped with on-chip 32 kHzoscillation circuit subclocks. Incorporating an on-chip high-speed SCI, DMAC,and DTC in addition to the standard peripheral modules in a small package, thisproduct group is capable of high-speed data transfer. Additionally, flashmemory programming via USB is supported by the inclusion of a USB interface(control/bulk/interrupt transfer). Since on-chip emulation (E10A) is supported(flash memory version only), development using more economical developmenttools possible.

Key Features:

Key Features of the H8S/2218 Group

  • H8S/2000 CPU
    • 24 MHz/3.0 to 3.6 V
    • 16 MHz/2.7 to 3.6 V
    • 6 MHz/2.4 to 3.6 V (masked ROM version
  • On-chip memory
    • 128 KB/12 KB (H8S/2218, H8S/2218C: Flash memory)
    • 64 KB/12 KB (H8S/2217C: Flash memory)
    • 64 KB/8 KB (H8S/2217: Masked ROM)
  • USB 2.0 full-speed function: 12 Mbps
    • Three transfer modes
    • Four endpoints
      (control x1, bulk x 2, interrupt x 1)
    • Total 456-byte FIFO (max: 128 bytes)
  • RTC (realtime clock)
  • Boundary scan function (flash memory version only)
    • Conforms to IEEE1149.1
  • On-chip emulator (E10A) supported (flash memory version only)
  • Flash memory programming I/F
    • USB boot mode programming
      • HD64F2218UTF, HD64F2218UBR
      • HD64F2218CUTF, HD64F2218CUBR
      • HD64F2217CUTF, HD64F2217CUBR
    • SCI boot mode programming
      • HD64F2218TF, HD64F2218BR
  • Packages

    Package

    Code
    (New Renesas code)

    Body size

    Pin pitch

    TQFP-100

    TFP-100G
    (PTQP0100LC-A)

    12.0 x 12.0 mm

    0.4mm

    LFBGA-112

    BP-112
    (PVQN0064LB-A)

    10.0 x 10.0 mm

    0.8mm
  • Product list
    H8S/2218C
    H8S/2218
    H8S/2217C
    H8S/2217
    Memory type
    Flash
    Flash
    Flash
    Mask
    On-chip memory
    (ROM/RAM)
    128KB/12KB
    128KB/12KB
    64KB/12KB
    64KB/8KB
    On-board flash memory
    programming method
    USB only
    USB/sci
    USB only
    -
    Support for
    industrial applications
    -
    ○
    -
    -
    Operating frequency/
    supply voltage
    24 MHz/3.0 to 3.6 V
    24MHz/3.0 to 3.6 V
    16MHz/2.7 to 3.6 V
    24MHz/3.0 to 3.6 V
    24MHz/3.0 to 3.6 V
    16MHz/2.7 to 3.6 V
    6MHz/2.4 to 3.6 V

Key Features of the H8S/2212 Group

  • H8S/2000CPU: Single-chip mode
    • 24 MHz/3.0 to 3.6 V
    • 16 MHz/2.7 to 3.6 V6 MHz/2.4 to 3.6 V (Masked ROM version
  • On-chip memory
    • 128 KB/12 KB (H8S/2212, H8S/2212C: Flash memory)
    • 64 KB/8 KB (H8S/2211, H8S/2211C: Flash memory)
    • 64 KB/8 KB (H8S/2211: Masked ROM)
    • 32 KB/8 KB (H8S/2210C: Flash memory)
    • 32 KB/4 KB (H8S/2210, H8S/2210S: Masked ROM)
  • USB 2.0 full-speed function: 12 Mbps
    • Three transfer modes
    • Four endpoints
      (control x 1, bulk x 2, interrupt x 1)
    • Total 456-byte FIFO (max: 128 bytes)
  • RTC (realtime clock)
  • On-chip emulator (E10A) supported (flash memory version only)
  • Flash memory programming I/F
    • USB boot mode programming
      • HD64F2212UFP, HD64F2212UNP
      • HD64F2212CUFP, HD64F2212CUNP
      • HD64F2211UFP, HD64F2211UNP
      • HD64F2211CUFP, HD64F2211CUNP
      • HD64F2210CUFP, HD64F2210CUNP
    • SCI boot mode programming
      • HD64F2212FP, HD64F2212NP
      • HD64F2211FP, HD64F2211NP
  • Packages

    Package

    Code
    (New Renesas code)

    Body size

    Pin pitch

    LQFP-64

    FP-64E
    (PLQP064KC-A)

    10.0x10.0mm

    0.5mm

    QFN-64

    TNP-64B
    (PVQN0064LB-A)

    8.0x8.0mm

    0.4mm
  • Product list
    H8S/2212C
    H8S/2212
    H8S/2211C
    H8S/2211
    H8S/2211
    H8S/2210C
    H8S/2210
    H8S/2210S
    Memory type
    Flash
    Flash
    Flash
    Flash
    Mask
    Flash
    Mask
    Mask
    On-chip memory
    (ROM/RAM)
    128KB/12KB
    128KB/12KB
    64KB/8KB
    64KB/8KB
    64KB/8KB
    32KB/8KB
    32KB/4KB
    32KB/4KB
    On-board flash memory
    programming method
    USB only
    USB/sci
    USB only
    USB/sci
    -
    USB only
    -
    -
    Support for
    industrial applications
    -
    ○
    -
    ○
    ○
    -
    ○
    -
    Operating frequency/
    supply voltage
    24 MHz/3.0 to 3.6 V
    24MHz/3.0 to 3.6 V
    16MHz/2.7 to 3.6 V
    24MHz/3.0 to 3.6 V
    24MHz/3.0 to 3.6 V
    16MHz/2.7 to 3.6V
    24MHz/3.0 to 3.6 V
    16MHz/2.7 to 3.6V
    6MHz/2.4 to 3.6V
    24MHz/3.0 to 3.6 V
    24MHz/3.0 to 3.6 V
    16MHz/2.7 to 3.6 V
    6MHz/2.4 to 3.6 V
    24MHz/3.0 to 3.6 V

Key Applications:

  • H8S/2218 Group
    TVs and digital TVs, video tape recorders and digital video camcorders, audiodevices, home appliances, cameras and digital still cameras, game consoles andelectronic musical instruments, remote controls, office equipment, PCperipherals (external memory, input, output, USB), communications equipment andtelephones, home information appliances, MD
  • H8S/2212 Group
    TVs and digital TVs, video tape recorders and digital video camcorders, audiodevices, home appliances, cameras and digital still cameras, game consoles andelectronic musical instruments, remote controls, office equipment, PCperipherals (external memory, input, output, USB), communications equipment andtelephones, factory automation and power supplies, home information appliances,MDs

General Functions

  • High-speed H8S/2000 central processing unit with 16-bit architecture
    • Upward-compatible with H8/300 and H8/300H CPUs on the object level
    • Sixteen 16-bit general registers
    • 65 basic instructions
    • Address space: 16 Mbytes
  • Interrupts
    • Internal: 31
    • External: 7
  • Bus controller (This function is not available in the H8S/2212 Group.)
    • External data bus width: 8/16 bits
  • Peripheral functions
    • DMA controller (DMAC)
    • 16-bit timer-pulse unit (TPU) x 3 ch
    • Watchdog timer (WDT) x 1 ch
    • Serial communication interface (SCI) x 2 ch
      • Smart Card I/F function
      • High-speed UART x 1 ch (SCI0)
    • Boundary scan (H8S/2218F only)
    • Universal serial bus (USB)
    • 10-bit A/D converter x 6 ch
    • Clock pulse generator
  • General I/O ports
    • I/O pins: 69 for the H8S/2218 Group, 37 for the H8S/2212 Group

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Compare Document Part No RAM Program memory Pin Count Operating Voltage Min Production Status Package
Code
PDF HD6432217XXXBR 8 64 112 2.4 Mass Production PLBG0112GA-A
(BP-112)
PDF HD6432210XXXFP 4 32 64 2.4 Mass Production PLQP0064KC-A
(FP-64E)
PDF HD6432217XXXBRW 8 64 112 2.4 Mass Production PLBG0112GA-A
(BP-112)
PDF HD6432210XXXFPW 4 32 64 2.4 Mass Production PLQP0064KC-A
(FP-64E)
PDF HD6432217XXXTF 8 64 100 2.4 Mass Production PTQP0100LC-A
(TFP-100G)
PDF HD6432217XXXTFW 8 64 100 2.4 Mass Production PTQP0100LC-A
(TFP-100G)
PDF HD64F2217CUBR24 12 64 112 3 Mass Production PLBG0112GA-A
(BP-112)
PDF HD64F2210CUFP24 8 32 64 3 Mass Production PLQP0064KC-A
(FP-64E)
PDF HD64F2217CUBR24W 12 64 112 3 Mass Production PLBG0112GA-A
(BP-112)
PDF HD64F2210CUFP24W 8 32 64 3 Mass Production PLQP0064KC-A
(FP-64E)
PDF HD64F2217CUTF24 12 64 100 3 Mass Production PTQP0100LC-A
(TFP-100G)
PDF HD64F2210CUNP24 8 32 64 3 Mass Production PVQN0064LB-A
(TNP-64B)
PDF HD64F2217CUTF24W 12 64 100 3 Mass Production PTQP0100LC-A
(TFP-100G)
PDF HD64F2210CUNP24W 8 32 64 3 Mass Production PVQN0064LB-A
(TNP-64B)
PDF HD64F2218CUBR24 12 128 112 3 Mass Production PLBG0112GA-A
(BP-112)
PDF HD6432210SXXXFPV 4 32 64 3 Under Development PLQP0064KC-A
(FP-64E)
PDF HD64F2218CUBR24W 12 128 112 3 Mass Production PLBG0112GA-A
(BP-112)
PDF HD6432210SXXXFPWV 4 32 64 3 Under Development PLQP0064KC-A
(FP-64E)
PDF HD64F2218CUTF24 12 128 100 3 Mass Production PTQP0100LC-A
(TFP-100G)
PDF HD6432210SXXXNPV 4 32 64 3 Under Development PVQN0064LB-A
(TNP-64B)

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