Skip to main content
My Renesas
Press Center
Events
Careers
Investor Relations
Contact Us
Japan English
Brazil (Português)
Europe/Middle East/Africa
Japan (日本語)
Mainland China/Hong Kong Region (简体中文)
Mainland China/Hong Kong Region (English)
Russia (Россия)
Singapore/South & Southeast Asia/Oceania
South Korea (한국어)
Taiwan Region (繁體中文)
Americas
(Change)
日本語
한국어
简体中文
繁體中文
Advanced Search
Products
Products Overview
MPU & MCU
Analog & Power
SoC / System LSI
Quality & Reliability
Package Items
RoHS
Lead-free/Halogen-free
Applications
Applications Overview
Key Technology
Development Tools
Development Tools
Find by Tool Category
Find by MPU & MCU
Alliance Partner
Support/Design
Support/Design
FAQ/Support
Software Library
ROM Code Procedures
e-learning
Contact Us
Buy/Samples
Buy/Samples
Contact Us
About Renesas
About Renesas
Corporate Outline
CSR and Environmental Activities
Procurement
What Are Semiconductors?
Home
Press Center
Press Releases
Provide feedback
Print this page
Press Releases
News (Category)
By Product
-- MCU & MPU
-- Analog & Power
-- SoC
By Solution
-- Communications
-- Consumer Electronics
-- Automotive
-- Industrial
Corporate/Management
-- Corporate
-- Research
-- Partnership
-- Ecology
-- Event
By Product
-- MCU & MPU
-- Analog & Power
-- SoC
By Solution
-- Communications
-- Consumer Electronics
-- Automotive
-- Industrial
Corporate/Management
-- Corporate
-- Research
-- Partnership
-- Ecology
-- Event
News Archive
2012
2011
2010
Notices
Renesas in the News
Presentations
Media Library
Corporate Information
Executive Team
Media Contacts
Press Releases (Research)
29 Jun 2010
Development of Close Proximity Wireless Technology with Integrated On-Chip Antenna
28 Jun 2010
Renesas Electronics Introduces New CMOS Isolator Technology that Realizes Highly-Integrated Inverter Circuits for Energy-Efficient Home Appliances and Electric Vehicles
23 Jun 2010
Renesas Electronics Announces Development of On-Chip Inductor Technology with a Wide Inductance Variability
09 Jun 2010
Renesas Electronics Announces Development of Package Design Technology for Implementation of High-Speed Interfaces at Low-Cost
Back To Top
End of content
Back To Top